Contact Mask Aligner
Suss Microtec MJB4
Manual mask alignment and exposure
Sample size: 1 to 4 wafer/substrate, thickness: up to 4 mm.
Mask Size 2 x 2 to 5 x 5. Mask thickness: up to 4.8 mm.
350 W Hg lamp source (i line exposures)
Constant intensity power supply
Hard contact, soft contact and vacuum contact print modes